ELECTRONIC ASSEMBLY

Procurement

Thanks to our international procurement network, qualified suppliers, auditing department and our excellent inventory management, we can optimize our production costs, allowing you to benefit from an economy of scale.

Electronic assembly

Our three automated assembly lines are equipped with state-of the-art technology. Regulated by an electronic schedule, they require minimal human intervention. Components accepted include: BGA, CSP and Flip Chip.

Mechanical integration

Our qualified workforce and our robotic assembly cell allows us to box your products for you. To ensure quality and efficiency, we fabricate specific assembly templates for each product.

Packaging

We are also able to ensure final packaging, the last stage before your product is sent out to your customers.

Turnkey service

We provide you with a complete solution that begins with an in-depth analysis of your requirements. From this analysis, we will propose solutions adapted to your specifications that may include product design, 3D printing, prototyping, manufacturing, boxing and even packaging of your products.

The flexibility of our ultra-modern assembly lines is the gauge of your satisfaction: finished products of the highest quality, on-time delivery and costs that are more than competitive on the electronics subcontracting market.

Exceptional production speed

Our manufacturing capacity adapts to small and large series, whether it uses surface mounting (SMT), thru-hole assembly or hybrid circuits using two technologies. Our pick and place machines allow us to apply up to 50,000 components per hour with the dimension of each piece attaining up to 01005. To ensure rapidity of execution while respecting high quality standards, we have three welding options available: wave soldering, selective wave soldering or by hand.

RoHS procedure

Aware of market demand, whenever desired we provide a solution that meets European Directive 2002/95/CE, aimed at limiting the use of dangerous substances. This procedure includes research into components meeting these requirements, as well as the possibility of lead-free soldering.